STM32F103C8T6
Manufacturer Part Number: STM32F103C8T6 | Manufacturer / Brand: STMicroelectronics |
Part of Description: SoC FPGA STM32F103C8T6 | Lead Free Status / RoHS Status: Lead free / RoHS Compliant |
Ship From: HK/Shen Zhen | Shipment Way: DHL/Fedex/TNT/UPS |
Datasheets: |
Product parameters
Manufacturer | STMicroelectronics |
RoHS | Details |
Product Status | Active |
Data Bus Width | 32 bit |
Package / Case | LQFP-48 |
Mounting Style | SMD/SMT |
Series | STM32F103C8 |
Packaging | Tray |
Brand | STMicroelectronics |
Maximum Operating Temperature | -40C |
Minimum Operating Temperature | +85 C |
Height | 1.4 mm |
Factory Pack Quantity | 1500 |
Moisture Sensitive | Yes |
Program Memory Type | Flash |
Number of I/Os | 37 I/O |
Unit Weight | 0.006349 oz |
Width | 7 mm |
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What is STM32F103C8T6?
ADM2687: This part of the code indicates the specific model or family of the IC.
EBRIZ: package type, temperature range, and potentially other specifications.
EB: Package type. This indicates the physical packaging of the IC. The exact details of the package (number of pins, form factor) can be found in the datasheet.
RIZ: specifications such as the temperature range, lead-free status, or other features.
STM32F103C8T6 Applications:
It has abundant peripheral resources, including multiple general-purpose I/O pins, serial communication interfaces, timers, analog-to-digital converters (ADCs), SPI, I2C, etc., which can meet various
application needs.
The chip also integrates flash memory and RAM inside to store program code and data.
It supports multiple communication protocols and buses, such as CAN, USB, Ethernet, etc., making it easy to communicate with other devices.
Widely used in various embedded systems and Internet of Things (IoT) devices.
It can be used in industrial automation control, household appliance control, smart home systems, electric tools, medical equipment, security systems and other fields.
Due to its abundant peripheral resources and communication interfaces, it is also commonly used in various sensor nodes, wireless communication modules, robot control and other application scenarios.