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XC7K325T-2FFG676I

Manufacturer Part Number: XC7K325T-2FFG676I Manufacturer / Brand: AMD
Part of Description: FPGA - Field Programmable Gate Array XC7K325T-2FFG676I Lead Free Status / RoHS Status: 16-bit Microcontrollers - MCU MCU 3/5V 56K Pb-free 64-QFP
Ship From: HK/Shen Zhen Shipment Way: DHL/Fedex/TNT/UPS
Datasheets:

Product parameters

ManufacturerAMD
DetailsRoHS
Mounting StyleSMD/SMT
Package / CaseFCBGA-676
Minimum Operating Temperature– 40 C
Maximum Operating Temperature+100 C
PackagingTray
Moisture SensitiveYes
Number of Logic Array Blocks – LABs25475 LAB
Factory Pack Quantity40
SubcategoryProgrammable Logic ICs
Product TypeFPGA – Field Programmable Gate Array
TradenameKintex
Unit Weight1.653361 oz

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    SUBMIT INFORMATION

    XC7K325T-2FFG676I is a Field-Programmable Gate Array (FPGA) device from the Kintex-7 series manufactured by Xilinx. It offers a wide range of features and capabilities, making it suitable for various applications in the field of programmable logic.

    Key Specifications

    • Device Family: Kintex-7
    • Package Type: FCBGA-676
    • Maximum I/O Count: 400
    • Logic Elements: 326,080 (approximately 478K logic cells)
    • Block RAM: 34Mb
    • DSP Slices: 1,920
    • DSP Performance: 2,845 GMAC/s
    • Transceivers: 32
    • Transceiver Speed: 12.5Gb/s
    • Serial Bandwidth: 800Gb/s
    • PCIe Interface: x8 Gen2
    • Voltage Range: 0.97V to 1.03V (with specific devices operating at 0.95V or 1.0V for certain speed grades)
    • Maximum Clock Frequency: Up to 1,818 MHz (though specific operating frequencies may vary based on configuration and temperature range)
    • Length: 27mm
    • Humidity Sensitivity Level: 4
    • Configurable Logic Blocks (CLBs): 25,475

    Features

    • High-Performance DSP Ratio: Provides excellent DSP performance with a high ratio of DSP slices to logic elements.
    • Cost-Effective Packaging: Offers high-density packaging at a competitive price.
    • Support for Mainstream Standards: Supports PCIe Gen3, 10 Gigabit Ethernet, and other popular communication protocols.
    • Flexible I/O Options: With 400 I/O pins, it offers flexibility in choosing I/O standards and configurations.
    • Advanced Interfaces: Includes interfaces such as AXI4 IP, flexible mixed-signal (AMS) integration, and VCXO components.
    • Temperature Range Options: Available in commercial, extended, industrial, expanded (-1Q), and military (-1M) temperature ranges.

    Applications

    The XC7K325T-2FFG676I is suitable for a wide range of applications, including:

    • 3G and 4G wireless applications
    • Flat panel displays
    • IP video solutions
    • Any other applications requiring high-performance programmable logic and DSP capabilities.

    Manufacturer Information

    For more detailed information, including electrical specifications, timing characteristics, and packaging options, please refer to the official datasheet available on the Xilinx website.

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