
W25Q16JVSSIQ
Manufacturer Part Number: W25Q16JVSSIQ | Manufacturer / Brand: Winbond |
Part of Description: NOR Flash spiFlash, 3V, 16M-bit, 4Kb Uniform Sector | Lead Free Status / RoHS Status: 16-bit Microcontrollers - MCU MCU 3/5V 56K Pb-free 64-QFP |
Ship From: HK/Shen Zhen | Shipment Way: DHL/Fedex/TNT/UPS |
Datasheets: |
Product parameters
Manufacturer | Winbond |
Details | RoHS |
Mounting Style | SMD/SMT |
Package / Case | SOIC-8 |
Minimum Operating Temperature | – 40 C |
Maximum Operating Temperature | +85 C |
Packaging | Tube |
Moisture Sensitive | Yes |
Interface Type | SPI |
Factory Pack Quantity | 90 |
Subcategory | Memory & Data Storage |
Product Type | NOR Flash |
Tradename | SpiFlash |
Unit Weight | 0.040948 oz |
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The W25Q16JVSSIQ is a high-performance, 16 Mbit SPI (Serial Peripheral Interface) flash memory device designed for a wide range of embedded applications. It features a robust architecture that supports fast read and write speeds, making it ideal for systems that require efficient data storage and retrieval.
With its advanced dual/quad SPI interfaces, the W25Q16JVSSIQ offers high-speed data transfer rates, allowing for faster system performance and reduced latency. The device also boasts a wide operating voltage range, making it compatible with a variety of power supply configurations.
The W25Q16JVSSIQ includes a comprehensive set of features that enhance its versatility and reliability. These include a robust erase/write endurance of up to 100,000 cycles and a data retention period of up to 20 years, ensuring that data remains intact and accessible even over extended periods of time.
Additionally, the device offers a variety of programming options, including byte, page, and sector erase capabilities, as well as support for standard SPI commands. This flexibility allows developers to tailor the device’s performance to their specific application needs.
Overall, the W25Q16JVSSIQ is an excellent choice for developers seeking a high-performance, reliable, and versatile SPI flash memory solution for their embedded systems. Its compact footprint, high-speed data transfer rates, and advanced features make it an attractive option for a wide range of applications, including industrial, automotive, and consumer electronics.