LSM6DSLTR
Manufacturer Part Number: ADM3251EARWZ | Manufacturer / Brand: ADI |
Part of Description: Digital Isolators Isolated 1/1 RS323 Transceiver | Lead Free Status / RoHS Status: Lead free / RoHS Compliant |
Ship From: HK/Shen Zhen | Shipment Way: DHL/Fedex/TNT/UPS |
Datasheets: |
Product parameters
Manufacturer | ADI |
RoHS | Details |
Mounting Style | SMD/SMT |
Package / Case | LGA-14 |
Sensor Type | 6-axis |
Interface Type | I2C, SPI |
Output Type | Digital |
Minimum Operating Temperature | – 40 C |
Maximum Operating Temperature | + 85 C |
Packaging | Reel |
Factory Pack Quantity | 5000 |
Subcategory | Sensors |
Type | IMUs – Inertial Measurement Units |
Unit Weight | 0.004233 oz |
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The LSM6DSLTR is a versatile and highly integrated inertial measurement unit (IMU) module manufactured by STMicroelectronics. This sensor module combines a 3-axis accelerometer and a 3-axis gyroscope in a single package, providing accurate motion sensing capabilities for various applications.
Key features of the LSM6DSLTR include:
- 3-axis accelerometer with selectable full-scale ranges.
- 3-axis gyroscope with configurable sensitivities.
- Digital interfaces such as I²C and SPI for communication.
- Embedded temperature sensor for monitoring environmental conditions.
- Integrated FIFO buffer for efficient data handling.
- Low power consumption modes for battery-operated devices.
- Advanced motion detection and activity recognition algorithms.
The LSM6DSLTR is used in applications such as wearable devices, smart sensors, robotics, drones, and other IoT (Internet of Things) applications where precise motion sensing and low power consumption are essential.
Example of LSM6DSLTR Description:
“The LSM6DSLTR from STMicroelectronics is an advanced 6-DOF (Degrees of Freedom) inertial measurement unit (IMU) featuring a 3-axis accelerometer and a 3-axis gyroscope. With digital interfaces including I²C and SPI, configurable full-scale ranges, and embedded motion detection algorithms, it is ideal for accurate motion sensing in wearable devices, IoT applications, and robotics.”