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HMC789ST89ETR

Manufacturer Part Number: HMC789ST89ETR Manufacturer / Brand: ADI
Part of Description: RF Amplifier Driver Amp, externally Tuned, .4-2GHz Lead Free Status / RoHS Status: 16-bit Microcontrollers - MCU MCU 3/5V 56K Pb-free 64-QFP
Ship From: HK/Shen Zhen Shipment Way: DHL/Fedex/TNT/UPS
Datasheets:

Product parameters

ManufacturerADI
DetailsRoHS
Mounting StyleSMD/SMT
Package / CaseSOT-89-3
Minimum Operating Temperature– 55 C
Maximum Operating Temperature+85 C
PackagingReel
Moisture SensitiveYes
Product TypeRF Amplifier
Factory Pack Quantity500
SubcategoryWireless & RF Integrated Circuits
Product TypeRF Amplifier
Width4 mm
Unit Weight0.004603 oz

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    The HMC789ST89ETR is a high-linearity GaAs InGaP HBT (Heterojunction Bipolar Transistor) gain block MMIC (Monolithic Microwave Integrated Circuit) amplifier. It operates within a frequency range of 0.7 to 2.8 GHz, making it suitable for a variety of RF (Radio Frequency) and microwave applications. This amplifier features high output IP3 (Third-Order Intercept Point) of +42 dBm (typically +45 dBm), which is a measure of its linearity and ability to handle strong signals without generating excessive distortion.

    The HMC789ST89ETR also offers high gain of 18 dB and a high output P1dB (1 dB compression point) of +25 dBm, indicating its capability to deliver significant power while maintaining good linearity. It operates from a single +5V power supply and requires a supply current of 125 mA. The device is packaged in the industry-standard SOT89 package, which is compact and suitable for surface-mount applications.

    With its high performance characteristics, the HMC789ST89ETR is ideal for use as a PA (Power Amplifier) driver or pre-driver in cellular/4G and fixed wireless environments. It can also be used in other RF and microwave applications such as WLAN (Wireless Local Area Network), cable modems, digital broadcast satellites, microwave radios, and test equipment.

    In summary, the HMC789ST89ETR is a versatile and high-performance RF amplifier that combines high linearity, high gain, and compact packaging to meet the demands of modern wireless communication systems and other RF applications.

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