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Manufacturer Part Number: XCZU47DR-2FFVE1156I Manufacturer / Brand: SXILINX
Part of Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ RFSoC Zynq®UltraScale+™ FPGA, 930K+ Logic Cells 533MHz, 1.333GHz 1156-FCBGA (35x35) Lead Free Status / RoHS Status: table_img Lead free / RoHS Compliant
Ship From: HK/Shen Zhen Shipment Way: DHL/Fedex/TNT/UPS

Product parameters

Mounting StyleSMD/SMT
Package / Case1156-BBGA, FCBGA
SpeedD533MHz, 1.333GHz
ArchitectureMCU, FPGA
RAM Size256KB
Minimum Operating Temperature– 40 C
Maximum Operating Temperature+ 85 C
Factory Pack Quantity2940
PeripheralsDMA, WDT
Supplier Device Package1156-FCBGA (35×35)
Number of I/O366

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    The XCZU47DR-2FFVE1156I is a high-performance device from Xilinx’s Zynq UltraScale+ RFSoC family. It combines programmable logic, real-time processors, and RF analog technology. Key features include:

    1. Programmable Logic: Offers a large array of configurable logic blocks (CLBs) for custom digital designs.
    2. Processors: Includes a quad-core ARM Cortex-A53 application processor and a dual-core ARM Cortex-R5 real-time processor.
    3. RF Data Converters: Integrates high-speed, high-precision RF-ADCs and RF-DACs for direct RF sampling applications.
    4. Memory: Features on-chip memory resources and support for external DDR4 memory interfaces.
    5. High Bandwidth: Provides high-bandwidth connectivity with integrated interfaces like PCIe, SATA, and multiple GTH/GTY transceivers.
    6. I/O Options: Supports a wide range of I/O standards and high-speed serial connectivity.
    7. Security: Incorporates advanced security features for encryption and authentication.
    8. Package: Comes in a 1156-ball Flip-Chip Ball Grid Array (FCBGA) package, suitable for high-performance and high-density applications.
    9. Temperature Range: Industrial grade, suitable for operating temperatures from -40°C to +100°C.

    The XCZU47DR-2FFVE1156I is ideal for applications in wireless communication, radar systems, test and measurement equipment, and other areas requiring high-speed data conversion and advanced processing capabilities.