L272M

Manufacturer Part Number: FDMF3035 Manufacturer / Brand: ON
Part of Description: Gate Drivers Smart Power Stage (SPS) Module Lead Free Status / RoHS Status: table_img Lead free / RoHS Compliant
Ship From: HK/Shen Zhen Shipment Way: DHL/Fedex/TNT/UPS
Datasheets:

Product parameters

ManufacturerON
DetailsRoHS
Mounting StyleSMD/SMT
Package / CaseDIP-8
Minimum Operating Temperature– 25 C
Maximum Operating Temperature+ 85 C
Output Current50 A
PackagingTube
PSRR – Power Supply Rejection Ratio54 dB
SubcategoryAmplifier ICs
Factory Pack Quantity3000
Width6.4 mm
Unit Weight0.030018 oz

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    SUBMIT INFORMATION

    The FDMF3035 is an advanced Smart Power Stage (SPS) module from ON Semiconductor, designed for high-efficiency DC-DC voltage regulation applications, especially in high-performance computing, server, and telecommunications systems. It integrates key power components such as MOSFETs, a driver IC, and advanced protection features into a single, compact package for optimal performance and thermal management.

    Description:

    • Type: Smart Power Stage (SPS) Module
    • Manufacturer: ON Semiconductor
    • Voltage Rating: Designed for input voltages up to 25V
    • Current Rating: Supports continuous output current up to 50A
    • Integration: Combines high- and low-side MOSFETs, a gate driver, and advanced control circuitry

    Key Features:

    • Integrated MOSFETs and Driver: Reduces the complexity of design by integrating key power components in a single module, saving space and improving overall performance.
    • High Efficiency: Optimized for high-frequency switching with low conduction and switching losses, providing exceptional efficiency in power conversion applications.
    • Thermal Protection: Built-in over-temperature protection to ensure safe operation and prevent thermal damage.
    • Current Sensing: Integrated current sensing provides accurate current measurement, enabling protection features like over-current protection and load monitoring.
    • Fault Protection: Includes features such as over-voltage, under-voltage, and over-current protection, ensuring reliable and safe operation.
    • Compact Package: Housed in a small, thermally efficient package, suitable for space-constrained designs and efficient heat dissipation.

    Applications:

    • High-Performance Computing: Ideal for use in processors, GPUs, and memory power delivery circuits where high efficiency and precise control are required.
    • Server and Data Centers: Used in high-density power supplies for servers, storage systems, and networking equipment.
    • Telecommunications: Suitable for telecommunications systems requiring reliable, high-efficiency voltage regulation.
    • DC-DC Converters: Perfect for high-current, high-efficiency DC-DC converter designs in a variety of applications.

    Package:

    • QFN (Quad Flat No-lead): A compact, thermally efficient package that enhances heat dissipation and minimizes footprint, making it ideal for dense PCBs.

    Reference Documents:

    For detailed technical specifications, circuit design recommendations, and application notes, refer to the FDMF3035 datasheet provided by ON Semiconductor on their official website.

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